Predicting Cushion Characteristic on New Type of Environmental Friendly Foam

Abstract

In this paper packaging device is in investigated which can be a critical component in the defence against the logistic stresses. This device is the foam based move damping or cushioning system. The continuous developing of the materials give us the possibility to apply new and possible environmental friendly packaging (EFP) materials. To apply these materials we have to know many parameters for example the cushion characteristic. We investigate the possibility of a predicting method to make the development process easier.